Alphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 14 days agoTSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard modelswww.tomshardware.comexternal-linkmessage-square4fedilinkarrow-up142arrow-down10
arrow-up142arrow-down1external-linkTSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard modelswww.tomshardware.comAlphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 14 days agomessage-square4fedilink
minus-squareWetBeardHairs@lemmy.worldlinkfedilinkEnglisharrow-up9·14 days agoI wonder what the end game is now that we are stacking chiplets onto substrates to build processors. Chips with heat pipes and power delivery integrated within the layers?
minus-squareUnfortunateShort@lemmy.worldlinkfedilinkEnglisharrow-up3·13 days agoTSMC is working on channels for liquid cooling build into chips, so we’ll probably submerge future ones
I wonder what the end game is now that we are stacking chiplets onto substrates to build processors. Chips with heat pipes and power delivery integrated within the layers?
TSMC is working on channels for liquid cooling build into chips, so we’ll probably submerge future ones